Capabilities

Crystal

Our Crystal and Shaping Departments are the "1st steps" of Bullen Semiconductor (Franklin Street Facility) COMPLETE "in house" Silicon manufacturing and machining

The Crystal Department processes Amphorous / Poly Silicon into "Single" or "Dislocation Free" Crystals (diameters ranging from 50 mm to 425 mm).

The Shaping Department receives the completed Silicon Crystals and utilizes 6 major processes (Cropping, OD Grinding, Wire Slicing, Edge Grinding, Cleaning and Annealing) to "ready" the Silicon "Blanks" for our QC or other departments. Bullen Semiconductor owns the worlds largest (crystal diameter capabilities) Wire Saw.